Mauro Emanuele Dinardo

To evaluate the risk of upper gastrointestinal complications (UGIC) associated with drug use in the paediatric population.This study is part of a large Italian prospective multicentre study. The study population included children hospitalised for acute conditions through the emergency departments of eight clinical centres. Patients admitted for UGIC (defined as endoscopically confirmed gastroduodenal lesions or clinically defined haematemesis or melena) comprised the case series; children hospitalised for neurological disorders formed the control group. Information on drug and vaccine exposure was collected through parental interview during the children's hospitalisation. Logistic regression was used to estimate ORs for the occurrence of UGIC associated with drug use adjusted for age, clinical centre and concomitant use of any drug.486 children hospitalised for UGIC and 1930 for neurological disorders were enrolled between November 1999 and November 2010. Drug use was higher in cases than in controls (73% vs 54%; p<0.001). UGICs were associated with the use of non-steroidal anti-inflammatory drugs (NSAIDs) (adjusted OR 2.9, 95% CI 2.1 to 4.0), oral steroids (adjusted OR 2.9, 95% CI 1.7 to 4.8) and antibiotics (adjusted OR 2.3, 95% CI 1.8 to 3.1). The duration of use of these drug categories was short (range 1-8 days). Paracetamol showed a lower risk (adjusted OR 2.0, 95% CI 1.5 to 2.6) compared to ibuprofen (adjusted OR 3.7, 95% CI 2.3 to 5.9), although with partially overlapping CIs.NSAIDs, oral steroids and antibiotics, even when administered for a short period, were associated with an increased risk of UGIC.

An all silicon pixel telescope has been assembled and used at the Fermilab Test Beam Facility (FTBF) since 2009 to provide precise tracking information for different test beam experiments with a wide range of Detectors Under Test (DUTs) requiring high resolution measurement of the track impact point. The telescope is based on CMS pixel modules left over from the CMS forward pixel production. Eight planes are arranged to achieve a resolution of less than 8 μm on the 120 GeV proton beam transverse coordinate at the DUT position. In order to achieve such resolution with 100×150 μm2 pixel cells, the planes were tilted to 25 degrees to maximize charge sharing between pixels. Crucial for obtaining this performance is the alignment software, called Monicelli, specifically designed and optimized for this system. This paper will describe the telescope hardware, the data acquisition system and the alignment software constituting this particle tracking system for test beam users.

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in the late 2020s, CMS will replace its entire tracking system. The requirements for the tracker are largely determined by the long operation time of 10 years with a peak instantaneous luminosity of up to 7.5 × 10 34 cm− 2 s− 1 in the ultimate performance scenario. In particular, the Inner Tracker (IT) is being completely redesigned featuring a front-end chip capable to deal with hit rates of up to 3.38 GHz/cm 2 . The communication between the front-end and the back-end electronics occurs through an optical link based on a custom Low-power Gigabit Transceiver which sends data at 10 and 2.5 Gbps on the uplink and downlink, respectively. The number of pixels has been increased by a factor of 6 with respect to the present detector, resulting in an unprecedented number of channels of about two billion, and covering a pseudorapidity region up to 4. This represents a challenging requirement for the data acquisition system since it needs to efficiently configure, monitor, and calibrate them. A dedicated data acquisition system, written in C++ and based on a custom µTCA board to handle trigger, data, and detector control, equipped with an FPGA, was developed to fully test and characterize the IT modules on a bench and with beam tests. In this note, we will describe the system architecture and its scalability to the final system which will be based on custom back-end boards equipped with FPGAs and CPUs.

Results of an extensive R&D program aiming at radiation hard, small pitch, 3D pixel sensors are reported. The CMS experiment is supporting this R&D in the scope of the Inner Tracker upgrade for the High Luminosity phase of the CERN Large Hadron Collider (HL-LHC). In the HL-LHC the Inner Tracker will have to withstand an integrated fluence up to 2.3×1016neq/cm2. A small number of 3D sensors were interconnected with the RD53A readout chip, which is the first prototype of 65 nm CMOS pixel readout chip designed for the HL-LHC pixel trackers. In this paper results obtained in beam tests before and after irradiation are reported. The irradiation of a single chip module was performed up to a maximum equivalent fluence of about 1×1016neq/cm2. The analysis of the collected data shows excellent performance: the spatial resolution in not irradiated sensors can reach about 3 to 5 μm, for inclined tracks, depending on the pixel pitch. The measured hit detection efficiencies are close to 99% measured both before and after the above mentioned irradiation fluence.

ADVERTISEMENT RETURN TO ISSUEPREVArticleNEXTElectron Rich Cluster Chemistry: Synthesis and Molecular and Electronic Structures of the Series of Clusters Ru4(CO)13(.mu.-PR2)2 with Expanded Metal FrameworksJohn F. Corrigan, Marie Dinardo, Simon Doherty, Graeme Hogarth, Yan Sun, Nicholas J. Taylor, and Arthur J. CartyCite this: Organometallics 1994, 13, 9, 3572–3580Publication Date (Print):September 1, 1994Publication History Published online1 May 2002Published inissue 1 September 1994https://doi.org/10.1021/om00021a033RIGHTS & PERMISSIONSArticle Views121Altmetric-Citations22LEARN ABOUT THESE METRICSArticle Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to reflect usage leading up to the last few days.Citations are the number of other articles citing this article, calculated by Crossref and updated daily. Find more information about Crossref citation counts.The Altmetric Attention Score is a quantitative measure of the attention that a research article has received online. Clicking on the donut icon will load a page at altmetric.com with additional details about the score and the social media presence for the given article. Find more information on the Altmetric Attention Score and how the score is calculated. Share Add toView InAdd Full Text with ReferenceAdd Description ExportRISCitationCitation and abstractCitation and referencesMore Options Share onFacebookTwitterWechatLinked InReddit PDF (4 MB) Get e-AlertscloseSupporting Info (1)»Supporting Information Supporting Information Get e-Alerts

Test beam results obtained with 3D pixel sensors bump-bonded to the RD53A prototype readout ASIC are reported. Sensors from FBK Italy and IMB-CNM (Spain) have been tested before and after proton-irradiation to an equivalent fluence of about 1 × 1016 ≠cm-2 (1 MeV equivalent neutrons). This is the first time that one single collecting electrode fine pitch 3D sensors are irradiated up to such fluence bump-bonded to a fine pitch ASIC. The preliminary analysis of the collected data shows no degradation on the hit detection efficiencies of the tested sensors after high energy proton irradiation, demonstrating the excellent radiation tolerance of the 3D pixel sensors. Thus, they will be excellent candidates for the extreme radiation environment at the innermost layers of the HL-LHC experiments.

We irradiated two diamond detectors with 62 MeV energy proton beam up to an integrated fluence of about 2×1015 protons/cm2 at INFN-LNS in Catania (Italy). The detectors were made of two high purity poly-crystal diamond sensors. The electric contacts of the two diamond sensors were from different sources and made with different techniques: a proprietary DLC/Pt/Au electric contact and our own novel UV Laser technique. We collected 120 GeV and 62 MeV proton beam data, before and after irradiation, respectively, to extract the radiation damage constant of one poly-crystal diamond sensor by using single crystal diamond detector response as reference.

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.

Due to the large expected instantaneous luminosity, the future HL-LHC upgrade sets strong requirements on the radiation hardness of the CMS detector Inner Tracker. Sensors based on 3D pixel technology, with its superior radiation tolerance, comply with these extreme conditions. A full study and characterization of pixelated 3D sensors fabricated by FBK is presented here. The sensors were bump-bonded to RD53A readout chips and measured at several CERN SPS test beams. Results on charge collection and efficiency, for both non-irradiated and irradiated up to 1016 neq/cm2 samples, are presented. Two main studies are described: in the first the behaviour of the sensor is qualified as a function of irradiation, while kept under identical conditions; in the second the response is measured under typical operating conditions.

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1016 neq/cm2 at ∼3 cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n+ on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100μm or 130μm, that of 3D sensors 130μm. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of ∼5×1015 neq/cm2 are reported in this article.

The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and charged particle trajectories. The sensors located in the innermost layers of the pixel detector must be upgraded for the ten-fold increase in luminosity expected at the High-Luminosity LHC (HL-LHC). As a possible replacement for planar sensors, 3D silicon technology is under consideration due to its good performance after high radiation fluence. In this paper, we report on pre- and post- irradiation measurements of CMS 3D pixel sensors with different electrode configurations from different vendors. The effects of irradiation on electrical properties, charge collection efficiency, and position resolution are discussed. Measurements of various test structures for monitoring the fabrication process and studying the bulk and surface properties of silicon sensors, such as MOS capacitors, planar and gate-controlled diodes are also presented.

Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for the innermost layers of tracking devices for the foreseen upgrades of the LHC. 3D sensors compatible with the CMS readout, fabricated at FBK (Trento, Italy), were tested in the laboratory and with a 120 GeV/c proton beam at the FNAL test beam facility, before and after irradiation up to a fluence of 3.5×1015neq/cm2. Preliminary results of the data analysis are presented.

Abstract Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate entirely in the detector bulk, perpendicularly to the surface. They are emerging as one of the most promising technologies for innermost layers of tracking devices for the foreseen upgrades of the LHC. Until recently, properties of 3D sensors have been investigated mostly with ATLAS readout electronics. 3D pixel sensors compatible with the CMS readout were first fabricated at SINTEF (Oslo, Norway), and more recently at FBK (Trento, Italy) and CNM (Barcelona, Spain). Several sensors with different electrode configurations, bump-bonded with the CMS pixel PSI46 readout chip, were characterized in laboratory and tested at Fermilab with a proton beam of 120 GeV/ c . Preliminary results of the data analysis are presented.

The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb−1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R&D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R&D effort are presented and discussed in this article.

The CMS silicon pixel detector is the tracking device closest to the LHC p–p collisions, which precisely reconstructs the charged particle trajectories. The planar technology used in the current innermost layer of the pixel detector will reach the design limit for radiation hardness at the end of Phase I upgrade and will need to be replaced before the Phase II upgrade in 2020. Due to its unprecedented performance in harsh radiation environments, 3D silicon technology is under consideration as a possible replacement of planar technology for the High Luminosity-LHC or HL-LHC. 3D silicon detectors are fabricated by the Deep Reactive-Ion-Etching (DRIE) technique which allows p- and n-type electrodes to be processed through the silicon substrate as opposed to being implanted through the silicon surface. The 3D CMS pixel devices presented in this paper were processed at FBK. They were bump bonded to the current CMS pixel readout chip, tested in the laboratory, and testbeams carried out at FNAL with the proton beam of 120 GeV/c. In this paper we present the laboratory and beam test results for the irradiated 3D CMS pixel devices.

The High Luminosity upgrade of the CERN Large Hadron Collider (HL–LHC) calls for an upgrade of the CMS tracker detector to cope with the increased radiation levels while maintaining the excellent performance of the existing detector. Specifically, new high-radiation tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to 1.9×1016neq/cm2 at 3 cm from the interaction point, need to be developed. For this purpose an R&D program involving different vendors have been pursued, aiming at the development of thin n-in-p type pixel sensors. The R&D covers both planar (manufactured by Fondazione Bruno Kessler, FBK; Hamamatsu Photonics, HPK and LFoundry) and single-sided 3D columnar (manufactured by FBK and Centro Nacional de Microelectronica, CNM) pixel devices. The target active thickness is 150μm while two different pixel cell dimensions are currently investigated (25 × 100 and 50×50μm2). Sensors presented in this article have been bump-bonded to the RD53A readout chip (ROC), the first prototype towards the development of a ROC to be employed during HL–LHC operation. Test beam studies, both of thin planar and 3D devices, have been performed by the CMS collaboration at the CERN, DESY and Fermilab test beam facilities. Results of modules performance before and after irradiation (up to 2.4×1016neq/cm2) are presented in this article.

This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 $$\upmu $$ m and 130 $$\upmu $$ m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors.

This paper describes the development of new 3D and planar silicon pixel sensors designed for the Compact Muon Solenoid (CMS) Phase-2 Upgrade at High Luminosity LHC (HL-LHC).The project is funded by INFN and sensors are produced in collaboration with the FBK foundry.The HL-LHC will operate at an instantaneous luminosity approximately 5 times larger than the original LHC design, significantly increasing the number of concurrent collisions per bunch crossing, the integrated luminosity delivered to the experiments and, as a consequence, the radiation dose that the detectors will have to sustain.In order to cope with these future conditions, upgrades to the detectors are required.This is necessary for the pixel tracker that is the closest to the interaction point and will be replaced.In this paper, the results, from beam tests performed at Fermilab Test Beam Facility, of thin (100 µm and 130 µm thick) n-in-p type sensors, assembled into hybrid single chip modules bump bonded to the PSI46dig readout chip, will be presented.A comparison of the performances obtained with planar sensors before and after proton irradiation up to 3 × 10 15 n eq /cm 2 will be also discussed.The paper will also report the results obtained with the first 3D pixel sensors 130 µm thick with columnar electrodes for different pixel cell prototypes.The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard 100 µm × 150 µm, down to 50 µm × 50 µm and 25 µm × 100 µm, which are the preferred dimensions in the high pile-up environment of the HL-LHC.

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new highly radiation tolerant silicon pixel sensors, capable of withstanding fluences up to 2.3 × 1016 neq/cm2 (1 MeV equivalent neutrons). In this paper results obtained in beam test experiments with 3D and planar pixel sensors interconnected with the RD53A readout chip are reported. RD53A is the first prototype in 65 nm technology issued by the RD53 collaboration for the future readout chip to be used in the upgraded pixel detectors. The interconnected modules have been tested in an electron beam at DESY, before and after irradiation, which was performed at the CERN IRRAD facility for the 3D sensors or at the KIT Irradiation Center for the planar sensors, up to an equivalent fluence of 1 × 1016 neq/cm2. The sensors were made by FBK foundry in Trento, Italy, and their development was done in collaboration with INFN (Istituto Nazionale di Fisica Nucleare, Italy). The analysis of the collected data shows hit detection efficiencies around 99% measured after irradiation. All results are obtained in the framework of the CMS R&D activities.

The LHC will be upgraded to the High Luminosity LHC (HL-LHC) in the coming years to reach an instantaneous luminosity as high as 7.5 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">34</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−2</sup> s <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup> . This will allow the ATLAS and CMS experiments to collect an integrated luminosity up to 4000 fb <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−1</sup> during the HL-LHC projected lifetime of ten years, hence increasing the discovery potential of both experiments. To ensure excellent performance despite an average pileup of 200, the CMS detector is going to be significantly upgraded. The new Inner Tracker has ×6 smaller pixels, resulting in about 2 billions channel, which is unprecedented. The front-end chip features a data readout speed of 1.28 Gbps, and a downlink for clock, trigger, and commands of 160 Mbps. The communication between the front-end and the back-end electronics occurs through an optical link based on a custom Low-power Gigabit Transceiver which sends data at 10.24 and 2.56 Gbps on the uplink and downlink, respectively. A dedicated data acquisition system, written in C++ and based on a custom micro Data, Trigger, and Control board, equipped with a Xilinx Kintex 7 FPGA, was developed to fully test and characterize the pixel modules. The system architecture and its capabilities are presented in this document.

This thesis concerns the development and characterization of a prototype Silicon micro-strip detector that can be used in the forward (high rapidity) region of a hadron collider. These detectors must operate in a high radiation environment without any important degradation of their performance. The innovative feature of these detectors is the readout electronics, which, being completely data-driven, allows for the direct use of the detector information at the lowest level of the trigger. All the particle hits on the detector can be readout in real-time without any external trigger and any particular limitation due to dead-time. In this way, all the detector information is available to elaborate a very selective trigger decision based on a fast reconstruction of tracks and vertex topology. These detectors, together with the new approach to the trigger, have been developed in the context of the BTeV R&D program; our aim was to define the features and the design parameters of an optimal experiment for heavy flavour physics at hadron colliders. Application of these detectors goes well beyond the BTeV project and, in particular, involves the future upgrades of experiments at hadron colliders, such as Atlas, CMS and LHCb. These experiments, indeed, are already considering for their future high-intensity runs a new trigger strategy a la BTeV. Their aim is to select directly at trigger level events containing Bhadrons, which, on several cases, come from the decay of Higgs bosons, Zo's or W±'s; the track information can also help on improving the performance of the electron and muon selection at the trigger level. For this reason, they are going to develop new detectors with practically the same characteristics as those of BTeV. To this extent, the work accomplished in this thesis could serve as guide-line for those upgrades.

We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke−), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid- state pixel sensor capable of surviving fluencies up to a few 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> particles cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at ∼3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R & D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100µm and 130µm active thickness for planar sensors, and 130µm for 3D sensors, the thinnest ones ever produced so far. First prototypes of hybrid modules bump-bonded to the present CMS readout chips have been tested in beam tests. Preliminary results on their performance before and after irradiation are presented.

The CMS pixel detector constitutes the inner core of the tracking system. It is designed to provide three high-precision hits at least per track up to an acceptance in η of ± 2.5. Together with the ATLAS and ALICE pixel detectors, it represents one of the biggest pixel systems ever built by our community. It consists of about 66 millions pixel cells, 150x100 μm2 area, distributed over three concentric barrel layers (48 millions) and four end-cap disks, two on each end of the barrel. I will describe the main features of the system, the project requirements and the performance measured

The pixel detector of the Compact Muon Solenoid (CMS) experiment consists of three barrel layers and two endcap disks at each side of the barrel section. The detector was installed in summer 2008, commissioned with the readout chip internal pulse generator, and used in cosmic ray trigger data taking in a 3.8 T magnetic field. Despite the excellent detector performance some problems arose after installation. In about a year we went through a complete and important sequence of steps that go from the insertion of the detector in CMS, calibration, running, extraction, maintenance, to the re-insertion, re-calibration and final running. In this paper a summary of the knowledge acquired during the first year of running will be presented. Currently 98.6% of the whole pixel detector is fully functional and results on detector performance are found to be in line with the design specifications.

We developed and characterized the first prototype of a silicon microstrip detector system to be used in the forward region (high rapidity) of high energy physics experiments. This detector features an innovative readout integrated circuit, the second version of the Fermilab Silicon Strip Readout chip (FSSR2), which, being completely data-driven, allows for the direct use of the detector information at the lowest level of the trigger. All the particle hits on the detector can be read out in real time without any external trigger and any particular limitation due to deadtime. The chip services 128 strips providing the address, the time-stamp and a 3 bit amplitude information for all hits. Several programmable features are included in the chip, such as an internal pulser, a baseline restorer, and a selectable signal peaking time and gain. The performance in terms of noise and threshold dispersion have been measured with and without sensor connected to the chip and at different values of peaking time and gain, confirming that the FSSR2 meets the design requirements. The electronic calibration has been crosschecked with a radioactive source of 241Am.

We describe a method we used to characterize micro-strip sensors, which were non-uniformly irradiated up to a fluence of ∼1014 1 MeV equivalent neutrons per cm2. The method allows for a complete bidimensional mapping of the sensor characteristics over the entire active area. Information is gathered through the Q–V characteristic, measured scanning the sensor with an infra-red laser source. Q–V characteristics are then fitted to a simple analytical model, which returns local full-depletion voltages, carrier lifetimes, etc. With the present method one can even obtain the profile of the absorbed fluence. The development and tuning of the present method have been done in the context of the R&D programs for the micro-strip forward tracker of the BTeV experiment at the Tevatron.

The High Luminosity upgrade of the CERN LHC collider (HL-LHC) demands for a new, highradiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10 16 n eq /cm 2 at ∼ 3 cm from the interaction point.To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler (FBK), is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC.The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100 µm and 130 µm active thickness for planar sensors, and 130 µm for 3D sensors, the thinnest ones ever produced so far.Prototypes of hybrid modules, bumpbonded to the RD53A readout chip, have been tested on beam.First results on their performance before and after irradiation are presented.