Lorenzo Uplegger

We have directly measured the energy threshold and efficiency for bubble nucleation from iodine recoils in a CF3I bubble chamber in the energy range of interest for a dark matter search. These interactions cannot be probed by standard neutron calibration methods, so we develop a new technique by observing the elastic scattering of 12 GeV/c negative pions. The pions are tracked with a silicon pixel telescope and the reconstructed scattering angle provides a measure of the nuclear recoil kinetic energy. The bubble chamber was operated with a nominal threshold of (13.6+-0.6) keV. Interpretation of the results depends on the response to fluorine and carbon recoils, but in general we find agreement with the predictions of the classical bubble nucleation theory. This measurement confirms the applicability of CF3I as a target for spin-independent dark matter interactions and represents a novel technique for calibration of superheated fluid detectors.

An all silicon pixel telescope has been assembled and used at the Fermilab Test Beam Facility (FTBF) since 2009 to provide precise tracking information for different test beam experiments with a wide range of Detectors Under Test (DUTs) requiring high resolution measurement of the track impact point. The telescope is based on CMS pixel modules left over from the CMS forward pixel production. Eight planes are arranged to achieve a resolution of less than 8 μm on the 120 GeV proton beam transverse coordinate at the DUT position. In order to achieve such resolution with 100×150 μm2 pixel cells, the planes were tilted to 25 degrees to maximize charge sharing between pixels. Crucial for obtaining this performance is the alignment software, called Monicelli, specifically designed and optimized for this system. This paper will describe the telescope hardware, the data acquisition system and the alignment software constituting this particle tracking system for test beam users.

The Mu2e experiment at Fermilab will attempt to detect a coherent neutrinoless conversion of a muon into an electron in the field of an aluminum nucleus, with a sensitivity that is 10,000 times greater than existing limits. The Mu2e trigger and data acquisition system (TDAQ) uses the otsdaq framework as its online Data Acquisition System (DAQ) solution. Developed at Fermilab, otsdaq integrates several components, such as an artdaq-based DAQ, an art-based event processing, and an EPICS-based detector control system (DCS), and provides a uniform multi-user interface to its components through a web browser. The data streams from the Mu2e tracker and calorimeter are handled by the artdaq-based DAQ and processed by a one-level software trigger implemented within the art framework. Events accepted by the trigger have their data combined, post-trigger, with the separately read-out data from the Mu2e Cosmic Ray Veto system. The foundation of Mu2e DCS, EPICS, an Experimental Physics and Industrial Control System, is an open-source platform for monitoring, controlling, alarming, and archiving. Over the last three years, a prototype of the TDAQ and DCS systems has been built and tested at Fermilab’s Feynman Computing Center. Currently, the production system installation is underway. At the end, this work presents a brief update on the installation of racks and DAQ hardware.

In this paper we report measurements of the uniformity of time resolution, signal amplitude, and charged particle detection efficiency across the sensor surface of low-gain avalanche detectors (LGAD). Comparisons of the performance of sensors with different doping concentrations and different active thicknesses are presented, as well as their temperature dependence and radiation tolerance up to 6×1014 n/cm2. Results were obtained at the Fermilab test beam facility using 120 GeV proton beams, and a high precision pixel tracking detector. LGAD sensors manufactured by the Centro Nacional de Microelectrónica (CNM) and Hamamatsu Photonics (HPK) were studied. The uniformity of the sensor response in pulse height before irradiation was found to have a 2% spread. The signal detection efficiency and timing resolution in the sensitive areas before irradiation were found to be 100% and 30–40 ps, respectively. A “no-response” area between pads was measured to be about 130 μm for CNM and 170μm for HPK sensors. After a neutron fluence of 6×1014 n/cm2 the CNM sensor exhibits a large gain variation of up to a factor of 2.5 when comparing metalized and non-metalized sensor areas. An irradiated CNM sensor achieved a time resolution of 30 ps for the metalized area and 40 ps for the non-metalized area, while a HPK sensor irradiated to the same fluence achieved a 30 ps time resolution.

The CMS pixel detector is the innermost tracking device at the LHC, reconstructing interaction vertices and charged particle trajectories. The current planar sensors located in the innermost layer of the pixel detector will be exposed to very high fluences which will degrade their performances. As a possible replacement for planar pixel sensors in the High Luminosity-LHC (HL-LHC), 3D silicon technology is under consideration due to its expected good performance in harsh radiation environments. Studies are also in progress for using 3D silicon pixel detectors in near-beam proton spectrometers at the LHC. Deep Reactive Ion Etching (DRIE) plays a key role in fabricating 3D silicon detectors in which readout and ohmic electrodes are processed through the silicon substrate instead of being implanted on the silicon surface. 3D pixel devices considered in this study were processed at FBK (Trento, Italy), bump bonded to the CMS pixel readout chip, and characterized in the laboratory. Numerical simulations were also carried out. We report on selected results from laboratory measurements and TCAD simulations.

We report on the response to a proton beam of scintillator tiles directly coupled at the face of the tile to multi-pixel photon counters. Detailed measurements with protons show that flat tiles have high response near the photon counters while concave tiles have uniform response suggesting that tiles with this versatile configuration can be tailored to a desired uniformity. The beam response is in qualitative agreement with the response to a non-triggered radioactive source and reveals additional spatial features.

Abstract Diamond sensors are studied as an alternative to silicon sensors to withstand the high radiation doses that are expected in future upgrades of the pixel detectors for the SLHC. Diamond pixel sensors are intrinsically radiation hard and are considered as a possible solution for the innermost tracker layers close to the interaction point where current silicon sensors cannot cope with the harsh radiation environment.An effort to study possible candidates for the upgrades is undergoing using the Fermilab test-beam facility (FTBF), where diamonds and 3D silicon sensors have been studied. Using a CMS pixel-based telescope built and installed at the FTBF, we are studying charge collection efficiencies for un-irradiated and irradiated devices bump-bonded to the CMS PSI46 pixel readout chip. A description of the test-beam effort and preliminary results on diamond sensors will be presented.

Abstract Light yield and spatial uniformity for a large variety of configurations of scintillator tiles were studied. The light from each scintillator was collected by a Silicon Photomultiplier (SiPM) directly viewing the produced scintillation light (SiPM-on-tile technique). The varied parameters included tile transverse size, tile thickness, tile wrapping material, scintillator composition, and SiPM model. These studies were performed using 120 GeV protons at the Fermilab Test Beam Facility. External tracking allowed the position of each proton penetrating a tile to be measured. The results were compared to a GEANT4 simulation of each configuration of scinitillator, wrapping, and SiPM.

We irradiated two diamond detectors with 62 MeV energy proton beam up to an integrated fluence of about 2×1015 protons/cm2 at INFN-LNS in Catania (Italy). The detectors were made of two high purity poly-crystal diamond sensors. The electric contacts of the two diamond sensors were from different sources and made with different techniques: a proprietary DLC/Pt/Au electric contact and our own novel UV Laser technique. We collected 120 GeV and 62 MeV proton beam data, before and after irradiation, respectively, to extract the radiation damage constant of one poly-crystal diamond sensor by using single crystal diamond detector response as reference.

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1016 neq/cm2 at ∼3 cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n+ on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100μm or 130μm, that of 3D sensors 130μm. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of ∼5×1015 neq/cm2 are reported in this article.

The CMS Forward Pixel Tracker will consist of two end-cap blocks, each made of two disks lodging sensors and Read-Out Chips (ROCs) (grouped into plaquettes of different sizes) for a total of about 18 million read-out channels. During the assembly phase, prior to the physical mounting of the plaquettes on the disks a thorough electronic test is necessary to check each channel for functionality, noise level, required threshold trimming and bump-bond quality. To this extent a complete test-stand system, based on custom PCI cards and specialized software, has been developed. Different methods have been evaluated and implemented to electronically assess the amount of malfunctioning bump-bonds. Determination of the correct parameters for initialization of the ROCs has also been implemented as an automatic procedure; data are finally fed into a centralized database for subsequent retrieval during detector initialization or for off-line analysis. In this paper we describe requirements, design and implementation of such a system, which is currently in use at the Silicon Detector Facility (SiDet) Laboratory of FNAL for the final assembly of the Forward Tracker system.

The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and charged particle trajectories. The sensors located in the innermost layers of the pixel detector must be upgraded for the ten-fold increase in luminosity expected at the High-Luminosity LHC (HL-LHC). As a possible replacement for planar sensors, 3D silicon technology is under consideration due to its good performance after high radiation fluence. In this paper, we report on pre- and post- irradiation measurements of CMS 3D pixel sensors with different electrode configurations from different vendors. The effects of irradiation on electrical properties, charge collection efficiency, and position resolution are discussed. Measurements of various test structures for monitoring the fabrication process and studying the bulk and surface properties of silicon sensors, such as MOS capacitors, planar and gate-controlled diodes are also presented.

In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×1015 n eq/cm2.

The Mu2e experiment at the Fermilab Muon Campus will search for the coherent neutrinoless conversion of a muon into an electron in the field of an aluminum nucleus with a sensitivity improvement by a factor of 10,000 over existing limits.The Mu2e Trigger and Data Acquisition System (TDAQ) uses otsdaq as the online Data Acquisition System (DAQ) solution.Developed at Fermilab, otsdaq integrates both the artdaq DAQ and the art analysis frameworks for event transfer, filtering, and processing.otsdaq is an online DAQ software suite with a focus on flexibility and scalability and provides a multi-user, web-based, interface accessible through a web browser.The data stream from the detector subsystems is read by a software filter algorithm that selects events which are combined with the data flux coming from a Cosmic Ray Veto System.The Detector Control System (DCS) has been developed using the Experimental Physics and Industrial Control System (EPICS) open source platform for monitoring, controlling, alarming, and archiving.The DCS System has been integrated into otsdaq.A prototype of the TDAQ and the DCS systems has been built at Fermilab's Feynman Computing Center.In this paper, we report on the progress of the integration of this prototype in the online otsdaq software.

The Electronic Systems Engineering department of the Computing Division at the Fermi National Accelerator Laboratory has assembled a pixel test beam telescope for high energy physics detector research and development. The telescope features CMS PSI46 readout chips and a data acquisition and control system known as the Compact And Programmable daTa Acquisition Node or CAPTAN. The CAPTAN is a flexible and powerful system that meets the readout and control demands of a variety of pixel and strip detectors for high energy physics applications. The CAPTAN functions in a gigabit Ethernet network, which facilitates the coordination of the multiple pixel planes of the telescope. Through the use of the CAPTAN hardware, a unified telescope system is attained encompassing both the CMS PSI46 pixel components and a device under test. This paper discusses results from the telescope project including mechanical design, alignment procedure, and attainable precision.

In this paper we present some results on the radiation tolerance of the CMS forward pixel detector. They were obtained from a beam test at Fermilab of a pixel-detector module, which was previously irradiated up to a maximum dose of 45 Mrad of protons at 200 MeV. It is shown that CMS forward pixel detector can tolerate this radiation dose without any major deterioration of its performance.

Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for the innermost layers of tracking devices for the foreseen upgrades of the LHC. 3D sensors compatible with the CMS readout, fabricated at FBK (Trento, Italy), were tested in the laboratory and with a 120 GeV/c proton beam at the FNAL test beam facility, before and after irradiation up to a fluence of 3.5×1015neq/cm2. Preliminary results of the data analysis are presented.

The fabrication of 3D detectors which requires bulk micromachining of columnar electrodes has been realized with advancements in MEMS technology. Since the fabrication of the first 3D prototype in Stanford Nanofabrication Facility in 1997, a significant effort has been put forth to transfer the 3D detector technology to large scale manufacturing for future high luminosity collider experiments, in which the radiation hardness will be the primary concern, and other applications such as medical imaging and X-ray imaging for molecular biology. First, alternative 3D structures, single type column (STC) and double-side double type column (DDTC) 3D detectors, were produced at FBK-irst (Trento, Italy) and CNM-Barcelona (Spain), and assessed thoroughly to improve the production technology towards the standard full-3D detectors. The 3D collaboration has been extended to include SINTEF (Norway), which is committed to small to medium scale production of active edge full-3D silicon sensors. This paper focuses on p-type 3D detectors compatible with the CMS pixel front end electronics from the second run of fabrication at SINTEF clean room facilities. The sensors that passed the wafer level electrical characterization have been bump-bonded at IZM (Germany), assembled into modules and wire-bonded for functional characterization at Purdue University. We report the leakage current characteristics, bump-bond quality, threshold, noise, and gain measurement results of these 3D modules as well as the preliminary beam test data taken at Fermi National Accelerator Laboratory.

Abstract Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate entirely in the detector bulk, perpendicularly to the surface. They are emerging as one of the most promising technologies for innermost layers of tracking devices for the foreseen upgrades of the LHC. Until recently, properties of 3D sensors have been investigated mostly with ATLAS readout electronics. 3D pixel sensors compatible with the CMS readout were first fabricated at SINTEF (Oslo, Norway), and more recently at FBK (Trento, Italy) and CNM (Barcelona, Spain). Several sensors with different electrode configurations, bump-bonded with the CMS pixel PSI46 readout chip, were characterized in laboratory and tested at Fermilab with a proton beam of 120 GeV/ c . Preliminary results of the data analysis are presented.

We present IV and CV curves for irradiated prototype n/sup +//n/p/sup +/ silicon pixel sensors, intended for use in the BTeV experiment at Fermilab. We tested pixel sensors from various vendors and with two pixel isolation techniques: p-stop and p-spray. Results are based on irradiation with 200-MeV protons up to 6/spl times/10/sup 14/ protons/cm/sup 2/.

High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is the technology able to meet these challenges. We report the first results of the BTeV silicon pixel detector beam test carried out at Fermilab in summer 2004. Tests were performed using a 120 GeV/c proton beam incident on a 6 plane pixel detector telescope. The last prototype developed for the BTeV experiment (FPIX2) is tested in the middle of the telescope. There is no external trigger, and events were built using the time-stamp information provided by the readout chips

The CMS silicon pixel detector is the tracking device closest to the LHC p–p collisions, which precisely reconstructs the charged particle trajectories. The planar technology used in the current innermost layer of the pixel detector will reach the design limit for radiation hardness at the end of Phase I upgrade and will need to be replaced before the Phase II upgrade in 2020. Due to its unprecedented performance in harsh radiation environments, 3D silicon technology is under consideration as a possible replacement of planar technology for the High Luminosity-LHC or HL-LHC. 3D silicon detectors are fabricated by the Deep Reactive-Ion-Etching (DRIE) technique which allows p- and n-type electrodes to be processed through the silicon substrate as opposed to being implanted through the silicon surface. The 3D CMS pixel devices presented in this paper were processed at FBK. They were bump bonded to the current CMS pixel readout chip, tested in the laboratory, and testbeams carried out at FNAL with the proton beam of 120 GeV/c. In this paper we present the laboratory and beam test results for the irradiated 3D CMS pixel devices.

The Mu2e experiment at the Fermilab will search for a coherent neutrinoless conversion of a muon into an electron in the field of an aluminum nucleus with a sensitivity improvement by a factor of 10,000 over existing limits. The Mu2e Trigger and Data Acquisition System (TDAQ) uses otsdaq framework as the online Data Acquisition System (DAQ) solution. Developed at Fermilab, otsdaq integrates several framework components — an artdaq-based DAQ, an art-based event processing, and an EPICS-based detector control system (DCS), and provides a uniform multi-user interface to its components through a web browser. Data streams from the Mu2e tracker and calorimeter are handled by the artdaq-based DAQ and processed by a one-level software trigger implemented within the art framework. Events accepted by the trigger have their data combined, post-trigger, with the separately read out data from the Mu2e Cosmic Ray Veto system. Foundation of the Mu2e DCS, EPICS – an Experimental Physics and Industrial Control System – is an open-source platform for monitoring, controlling, alarming, and archiving. A prototype of the TDAQ and the DCS systems has been built and tested over the last three years at Fermilab’s Feynman Computing Center, and now the production system installation is underway. This work presents their status and focus on the installation plans and procedures for racks, workstations, network switches, gateway computers, DAQ hardware, slow controls implementation, and testing.

Planar n-in-n silicon detectors with small pitches and slim edges are being investigated for the innermost layers of tracking devices for the foreseen upgrades of the LHC experiments. Sensor prototypes compatible with the CMS readout, fabricated by Sintef, were tested in the laboratory and with a 120 GeV/c proton beam at the Fermilab test beam facility before and after irradiation with up to 2×1015 neq/cm2 fluence. Preliminary results of the data analysis are presented.

The artdaqToolkit is a data-acquisition (DAQ) framework for use in high-energy physics experiments. Developed at Fermilab, it is the primary DAQ system for Fermilab’scurrent and next-generation experiments. • artdaqis a single framework used by experiments with radically different DAQ requirements – In addition to those shown below, ICARUS, Fermilab Test Beam Facility (See poster!), SENSEI and other CCD experiments, … • otsdaq product is an artdaq-based complete DAQ solution

The Real-Time Systems Engineering Department of the Scientific Computing Division at Fermilab has deployed set of customizations to our Off-The-Shelf Data Acquisition solution (otsdaq) at the Fermilab Test Beam Facility (FTBF) to read out the beamline instrumentation in support of FTBF users. In addition to reading out several detectors which use various detection technologies and readout hardware, the FTBF Data Acquisition system (DAQ) can perform basic track reconstruction through the facility in real time and provide data to facility users. An advanced prototype smart coincidence module, known as the NIM+, performs trigger distribution and throttling, allowing the beamline instrumentation to be read out at different rates. Spill data are saved to disk for studies of the facility performance, and hit data are also made available on the FTBF network for experiments' use. A web-based run control and configuration GUI are provided, and the online monitoring snapshots created after each beam spill are viewable from any computer connected to the Fermilab network. The integrated DAQ system for the facility provides users with high-precision tracking data along the beamline and a single location for obtaining data from the facility detectors, which set the baseline for testing their own detectors.

The CMS Level-1 calorimeter trigger is being upgraded in two stages to maintain performance as the LHC increases pile-up and instantaneous luminosity in its second run. In the first stage, improved algorithms including event-by-event pile-up corrections are used. New algorithms for heavy ion running have also been developed. In the second stage, higher granularity inputs and a time-multiplexed approach allow for improved position and energy resolution. Data processing in both stages of the upgrade is performed with new, Xilinx Virtex-7 based AMC cards.

Pomone is a flexible read-out system, designed in the context of the BTeV pixel test beam, based upon a PCI-compliant board and a custom-built mezzanine card to accommodate different detector front-end components. The system consists of a rich set of C++ classes to provide the backbone functionalities needed to readout a pixel detector in a continuous mode, and a collection of GUIs to allow users to interact with all the hardware components. The system has been designed with a high level of generality in order to accommodate different kind of detectors as well as different event-building strategies. A detailed description of the system, running under the Linux platform, is provided, along with a discussion of specific solutions adopted to meet the requirements of efficiency and modularity posed by the design.

The High-Luminosity LHC (HL-LHC) upgrade of the CMS pixel detector will require the development of novel pixel sensors which can withstand the increase in instantaneous luminosity to L=5×1034 cm−2s−1 and collect ∼ 3000 fb−1 of data. The innermost layer of the pixel detector will be exposed to doses of about 1016 neq/ cm2. Hence, new pixel sensors with improved radiation hardness need to be investigated. A variety of silicon materials (Float-zone, Magnetic Czochralski and Epitaxially grown silicon), with thicknesses from 50 μm to 320 μm in p-type and n-type substrates have been fabricated using single-sided processing. The effect of reducing the sensor active thickness to improve radiation hardness by using various techniques (deep diffusion, wafer thinning, or growing epitaxial silicon on a handle wafer) has been studied. The results for electrical characterization, charge collection efficiency, and position resolution of various n-on-p pixel sensors with different substrates and different pixel geometries (different bias dot gaps and pixel implant sizes) will be presented.

An enhancement to the T-980 bent crystal collimation experiment at the Tevatron has been completed. The enhancement was the installation of a pixel telescope inside the vacuum-sealed beam pipe of the Tevatron. The telescope is comprised of six CMS PSI46 pixel plaquettes, arranged as three stations of horizontal and vertical planes, with the CAPTAN system for data acquisition and control. The purpose of the pixel telescope is to measure beam profiles produced by bent crystals under various conditions. The telescope electronics inside the beam pipe initially were not adequately shielded from the image current of the passing beams. A new shielding approach was devised and installed, which resolved the problem. The noise issues encountered and the mitigating techniques are presented herein, as well as some preliminary results from the telescope.

The Electronic Systems Engineering Department of the Computing Sector at the Fermi National Accelerator Laboratory has undertaken the effort of designing an AMC that meets the specifications within the MicroTCA framework. The application chosen to demonstrate the hardware is the real-time event assembly of data taken by a particle tracking pixel telescope. In the past, the telescope would push all of its data to a PC where the data was stored to disk. Then event assembly, geometry inference, and particle tracking were all done at a later time. This approach made it difficult to efficiently assess the quality of the data as it was being taken - at times, resulting in wasted test beam time. Now, we can insert in the data path, between the telescope and the PC, a commercial MicroTCA crate housing our AMC. The AMC receives, buffers, and processes the data from the tracking telescope and transmits complete, assembled events to the PC in real-time. In this paper, we report on the design approach and the results achieved when the MicroTCA hardware was employed for the first time during a test beam run at the Fermi Test Beam Facility in 2012.

High-energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump-bonded to arrays of front-end electronic cells) is the state-of-the-art technology able to meet these challenges. We report on irradiation studies performed on BTeV pixel readout chip prototypes exposed to a 200-MeV proton beam at the Indiana University Cyclotron Facility. A prototype pixel readout chip (preFPIX2) has been developed at Fermilab for collider experiments and implemented in standard 0.25-/spl mu/m CMOS technology following radiation-tolerant design rules. The chip contains a variety of functional blocks (analog front ends, registers, state machines, and digital-to-analog converters). The tests confirm the radiation tolerance to proton total dose up to 87 Mrad of all of these circuits. In addition, nondestructive radiation-induced single-event upsets have been observed in on-chip static registers, and the single-bit upset cross-section has been extensively measured.

This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 $$\upmu $$ m and 130 $$\upmu $$ m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors.

This paper describes the development of new 3D and planar silicon pixel sensors designed for the Compact Muon Solenoid (CMS) Phase-2 Upgrade at High Luminosity LHC (HL-LHC).The project is funded by INFN and sensors are produced in collaboration with the FBK foundry.The HL-LHC will operate at an instantaneous luminosity approximately 5 times larger than the original LHC design, significantly increasing the number of concurrent collisions per bunch crossing, the integrated luminosity delivered to the experiments and, as a consequence, the radiation dose that the detectors will have to sustain.In order to cope with these future conditions, upgrades to the detectors are required.This is necessary for the pixel tracker that is the closest to the interaction point and will be replaced.In this paper, the results, from beam tests performed at Fermilab Test Beam Facility, of thin (100 µm and 130 µm thick) n-in-p type sensors, assembled into hybrid single chip modules bump bonded to the PSI46dig readout chip, will be presented.A comparison of the performances obtained with planar sensors before and after proton irradiation up to 3 × 10 15 n eq /cm 2 will be also discussed.The paper will also report the results obtained with the first 3D pixel sensors 130 µm thick with columnar electrodes for different pixel cell prototypes.The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard 100 µm × 150 µm, down to 50 µm × 50 µm and 25 µm × 100 µm, which are the preferred dimensions in the high pile-up environment of the HL-LHC.

The Real-Time Systems Engineering Department of the Scientific Computing Division at Fermilab is developing a flexible, scalable, and powerful data-acquisition (DAQ) toolkit which serves the needs of experiments from bench-top hardware tests to large high-energy physics experiments. The toolkit provides data transport and event building capabilities with the option for experimenters to inject art analysis code at key points in the DAQ for filtering or monitoring. The toolkit also provides configuration management, run control, and low-level hardware communication utilities. Firmware blocks for several commercial data acquisition boards are provided, allowing experimenters to approach the DAQ from a high level. A fully-functional DAQ "solution" of the toolkit is provided in otsdaq, sacrificing some flexibility in favor of being ready-to-use. artdaq is being used for several current and upcoming experiments, and will continue to be refined and expanded for use in the next generation of neutrino and muon experiments.

At Fermilab, there is an ongoing pixel detector R&D effort for high energy physics with the objective of developing high performance vertex detectors suitable for the next generation of HEP experiments. The pixel module presented here is a direct result of work undertaken for the cancelled BTeV experiment. It is a very mature piece of hardware, having many characteristics of high performance, low mass and radiation hardness driven by the requirements of the BTeV experiment. The detector presented in this paper consists of three basic devices; the readout integrated circuit (IC) FPIX2A, the pixel sensor (TESLA p-spray) and the high density interconnect (HDI) flex circuit that is capable of supporting eight readout ICs. The characterization of the pixel multichip module prototype as well as the baseline design of the eight-chip pixel module and its capabilities are presented. The PCI test adapter (PTA) card used to characterize the pixel module prototypes is also presented. These prototypes were characterized for threshold and noise dispersion. The bump-bonds of the pixel module were examined using an X-ray inspection system. Furthermore, the connectivity of the bump-bonds was tested using a radioactive source ( <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">90</sup> Sr), while the absolute calibration of the modules was achieved using an X-ray source. This paper provides a view of the integration of the three components that together comprise the pixel multichip module

Abstract The Mu2e experiment at the Fermilab Muon Campus will search for the coherent neutrinoless conversion of a muon into an electron in the field of an aluminum nucleus with a sensitivity improvement by a factor of 10000 over existing limits. The Mu2e Trigger and Data Acquisition System (TDAQ) uses otsdaq as the online Data Acquisition System (DAQ) solution. Developed at Fermilab, otsdaq integrates both the artdaq DAQ and the art analysis frameworks for event transfer, filtering, and processing. otsdaq is an online DAQ software suite with a focus on flexibility and scalability and provides a multi-user, web-based, interface accessible through a web browser. The data stream from the detector subsystems is read by a software filter algorithm that selects events which are combined with the data flux coming from a cosmic ray veto system. The Detector Control System (DCS) has been developed using the Experimental Physics and Industrial Control System (EPICS) open source platform for monitoring, controlling, alarming, and archiving. The DCS system has been integrated into otsdaq . A prototype of the TDAQ and the DCS systems has been built at Fermilab’s Feynman Computing Center. In this paper, we report on the progress of the integration of this prototype in the online otsdaq software.

At Fermilab, there is an ongoing pixel detector RD the readout integrated circuit (IC) FPIX2A [2][5], the pixel sensor (TESLA p-spray) [6] and the high density interconnect (HDI) flex circuit [1][3] that is capable of supporting eight readout ICs. The characterization of the pixel multichip module prototype as well as the baseline design of the eight chip pixel module and its capabilities are presented. These prototypes were characterized for threshold and noise dispersion. The bump-bonds of the pixel module were examined using an X-ray inspection system. Furthermore, the connectivity of the bump-bonds was tested using a radioactive source ({sup 90}Sr), while the absolute calibration of the modules was achieved using an X-ray source. This paper provides a view of the integration of the more » three components that together comprise the pixel multichip module. « less

We report on high-dose irradiation studies performed with a 200 MeV proton beam on a 140 Mbit/s pixel-data serializer prototype realized in standard 0.25 μm CMOS technology. The data serializer was implemented recently for the BTeV pixel readout chip developed at Fermilab.

The Compact Muon Solenoid (CMS) experiment is currently installing upgrades to their Calorimeter Trigger for LHC Run 2 to ensure that the trigger thresholds can stay low, and physics data collection will not be compromised. The electronics will be upgraded in two stages. Stage-1 for 2015 will upgrade some electronics and links from copper to optical in the existing calorimeter trigger so that the algorithms can be improved and we do not lose valuable data before stage-2 can be fully installed by 2016. Stage-2 will fully replace the calorimeter trigger at CMS with a micro-TCA and optical link system. It requires that the updates to the calorimeter back-ends, the source of the trigger primitives, be completed. The new system's boards will utilize Xilinx Virtex-7 FPGAs and have hundreds of high-speed links operating at up to 10 Gbps to maximize data throughput. The integration, commissioning, and installation of stage-1 in 2015 will be described, as well as the integration and parallel installation of the stage-2 in 2015, for a fully upgraded CMS calorimeter trigger in operation by 2016.

We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke−), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

One of the particular characteristics of diamond detectors is their fast charge collection time. This feature makes these detectors very attractive for timing measurements in both nuclear and particle physics experiments. The charge collection time in these detectors is of the order of a few hundred ps, therefore the timing performance depends greatly on the electronics readout of the detector. In this work we present comparative measurements made using a single crystal diamond detector and two different electronic readout chains. In particular, we used a charge sensitive amplifier (CSA) with a 100 MHz bandwidth and a voltage amplifier with a 2 GHz bandwidth. In order to evaluate the performance of the detector for charge signals generated by particles with energies below minimum ionizing, measurements were taken using 62 MeV proton beam at the INFN - Laboratori Nazionali del Sud. Another set of measurements was made with a 120 GeV proton beam at FNAL in order to evaluate the performance with MIP. The timing performance depends on the rise time of the signal and the Signal to Noise ratio. Both these characteristics are inversely related to the electronic readout bandwidth. The charge collection with the 62 MeV proton beam was about 130 Ke <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-</sup> . A SIN ratio of about 80 was obtained with the CSA, while the SIN ratio was approximately 4 with the 2 GHz broad-band amplifier. This resulted in a comparable time distribution value of around 70 ps RMS in both cases. However, charge collection is much smaller with minimum ionizing particles, and while it was possible to perform measurements with the CSA, with the broadband amplifier it was not possible to separate signals from the background noise. In this work we present and discuss the set-up used and the complete set of measurements, with final considerations regarding range of use to which these detector can be utilized.

An enhancement to the T-980 bent crystal collimation experiment at the Tevatron has been completed. The enhancement was the installation of a pixel telescope inside the vacuum-sealed beam pipe of the Tevatron. The telescope is comprised of six CMS PSI46 pixel plaquettes, arranged as three stations of horizontal and vertical planes, with the CAPTAN system for data acquisition and control. The purpose of the pixel telescope is to measure beam profiles produced by bent crystals under various conditions. The telescope electronics inside the beam pipe initially were not adequately shielded from the image current of the passing beams. A new shielding approach was devised and installed, which resolved the problem. The noise issues encountered and the mitigating techniques are presented herein, as well as some preliminary results from the telescope.

Charge-dependent anisotropy Fourier coefficients ($v_n$) of particle azimuthal distributions are measured in pPb and PbPb collisions at $ \sqrt{\smash[b]{s_{_{\mathrm{NN}}}}} = $ 5.02 TeV with the CMS detector at the LHC. The normalized difference in the second-order anisotropy coefficients ($v_2$) between positively and negatively charged particles is found to depend linearly on the observed event charge asymmetry with comparable slopes for both pPb and PbPb collisions over a wide range of charged particle multiplicity. In PbPb, the third-order anisotropy coefficient, $v_3$, shows a similar linear dependence with the same slope as seen for $v_2$. The observed similarities between the $v_2$ slopes for pPb and PbPb, as well as the similar slopes for $v_2$ and $v_3$ in PbPb, are compatible with expectations based on local charge conservation in the decay of clusters or resonances, and constitute a challenge to the hypothesis that the observed charge asymmetry dependence of $v_2$ in heavy ion collisions arises from a chiral magnetic wave.

The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid- state pixel sensor capable of surviving fluencies up to a few 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> particles cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at ∼3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R & D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100µm and 130µm active thickness for planar sensors, and 130µm for 3D sensors, the thinnest ones ever produced so far. First prototypes of hybrid modules bump-bonded to the present CMS readout chips have been tested in beam tests. Preliminary results on their performance before and after irradiation are presented.

The Compact Muon Solenoid Experiment (CMS) will start taking data at the Large Hadron Collider (LHC) in 2008. The closest detector to the interaction point is the silicon pixel detector which is the heart of the tracking system. It consists of three barrel layers and two pixel disks on each side of the interaction point for a total of 66 million channels. Its proximity to the interaction point means there will be very large particle fluences and therefore a radiation-tolerant design is necessary. The pixel detector will be crucial to achieve a good vertex resolution and will play a key role in pattern recognition and track reconstruction. The results from test beam runs prove that the expected performances can be achieved. The detector is currently being assembled and will be ready for insertion into CMS in early 2008. During the assembly phase, a thorough electronic test is being done to check the functionality of each channel to guarantee the performance required to achieve the physics goals. This report will present the final detector design, the status of the production as well as results from test beam runs to validate the expected performance.

The Mu2e experiment at the Fermilab Muon Campus will search for the coherent neutrinoless conversion of a muon into an electron in the field of an aluminum nucleus with a sensitivity improvement by a factor of 10,000 over existing limits.The Mu2e Trigger and Data Acquisition System (TDAQ) uses otsdaq as the online Data Acquisition System (DAQ) solution.Developed at Fermilab, otsdaq integrates both the artdaq DAQ and the art analysis frameworks for event transfer, filtering, and processing.otsdaq is an online DAQ software suite with a focus on flexibility and scalability and provides a multi-user, web-based, interface accessible through a web browser.The data stream from the detector subsystems is read by a software filter algorithm that selects events which are combined with the data flux coming from a Cosmic Ray Veto System.The Detector Control System (DCS) has been developed using the Experimental Physics and Industrial Control System (EPICS) open source platform for monitoring, controlling, alarming, and archiving.The DCS System has been integrated into otsdaq.A prototype of the TDAQ and the DCS systems has been built at Fermilab's Feynman Computing Center.In this paper, we report on the progress of the integration of this prototype in the online otsdaq software.

The Mu2e experiment at the Fermilab Muon Campus will search for the coherent neutrinoless conversion of a muon into an electron in the field of an aluminum nucleus with a sensitivity improvement by a factor of 10,000 over existing limits. The Mu2e Trigger and Data Acquisition System (TDAQ) uses otsdaq as the online Data Acquisition System (DAQ) solution. Developed at Fermilab, otsdaq integrates both the artdaq DAQ and the art analysis frameworks for event transfer, filtering, and processing. otsdaq is an online DAQ software suite with a focus on flexibility and scalability and provides a multiuser, web-based, interface accessible through a web browser. The data stream from the detector subsystems is read by a software filter algorithm that selects events which are combined with the data flux coming from a Cosmic Ray Veto System. The Detector Control System (DCS) has been developed using the Experimental Physics and Industrial Control System (EPICS) open source platform for monitoring, controlling, alarming, and archiving. The DCS System has been integrated into otsdaq . A prototype of the TDAQ and the DCS systems has been built at Fermilab’s Feynman Computing Center. In this paper, we report on the progress of the integration of this prototype in the online otsdaq software.

The muon campus program at Fermilab includes the Mu2e experiment that will search for a charged-lepton flavor violating processes where a negative muon converts into an electron in the field of an aluminum nucleus, improving by four orders of magnitude the search sensitivity reached so far.Mu2e's Trigger and Data Acquisition System (TDAQ) uses otsdaq solution.Developed at Fermilab, otsdaq uses the artdaq DAQ framework and art analysis framework, for event transfer, filtering, and processing.otsdaq is an online DAQ software suite with a focus on flexibility and scalability, and provides a multi-user interface accessible through a web browser.A Detector Control System (DCS) for monitoring, controlling, alarming, and archiving has been developed using the Experimental Physics and Industrial Control System (EPICS) open source Platform.The DCS System has also been integrated into otsdaq, providing a GUI multi-user, web-based control, and monitoring dashboard.

Mu2e tracker and calorimeter are handled by the artdaq-based DAQ and processed by a one-level software trigger implemented within the art framework. Events accepted by the trigger have their data combined, post-trigger, with the separately read out data from the Mu2e Cosmic Ray Veto system. Foundation of the Mu2e DCS, EPICS – an Experimental Physics and Industrial Control System – is an open-source platform for monitoring, controlling, alarming, and archiving. A prototype of the TDAQ and the DCS systems has been built and tested over the last three years at Fermilab’s Feynman Computing Center, and now the production system installation is underway. This work presents their status and focus on the installation plans and procedures for racks, workstations, network switches, gateway computers, DAQ hardware, slow controls implementation, and testing.

The requirements for an ILC Test Beam silicon telescope system are foreseen to be very stringent. Resolution, noise, and throughput must be carefully managed in order to provide a useful instrument for the high energy physics community to develop detector technologies for the ILC. Since the ILC Test Beam is meant to test a wide variety of different detectors, it must employ universally accepted software techniques, hardware standards and protocols as well as easy integration of hardware and software with the various clients using the system. In this paper, we describe an open modular architecture to achieve these goals, including an analysis of the entire chain of software and hardware needed to meet the requirements.

The Front-End R&D group at Fermilab has been developing pixel hybridized modules and silicon strip detectors for the past decade for high-energy physics experiments. To accomplish this goal, one of the activities the group has been working on includes the development of a flexible high-speed and high-bandwidth data acquisition and test system to characterize front-end electronics. In this paper, we present a general purpose PCI-based test stand system developed to meet the stringent requirements of testing silicon strip and pixel detectors. The test stand is based on a platform that is flexible enough to be adapted to different types of front-end electronics. This system has been used to test the performance of the electronics for different experiments such as BTeV, CDF, CMS, and Phenix. The paper presents the capabilities of the system and how it can be adapted to meet the testing requirements of different applications.

This Technical Memorandum (TM) summarizes the Fermilab Test Beam operations for FY2017. It is one of a series of annual publications intended to gather information in one place. In this case, the information concerns the individual experiments that ran at FTBF and are listed in Table 1. Each experiment section was prepared by the relevant authors, and was edited for inclusion in this summary.

The Real-Time Systems Engineering Department of the Scientific Computing Division at Fermilab has deployed set of customizations to our Off-The-Shelf Data Acquisition solution (otsdaq) at the Fermilab Test Beam Facility (FTBF) to read out the beamline instrumentation in support of FTBF users. In addition to reading out several detectors which use various detection technologies and readout hardware, the FTBF Data Acquisition system (DAQ) can perform basic track reconstruction through the facility in real time and provide data to facility users. An advanced prototype smart coincidence module, known as the NIM+, performs trigger distribution and throttling, allowing the beamline instrumentation to be read out at different rates. Spill data are saved to disk for studies of the facility performance, and hit data are also made available on the FTBF network for experiments' use. A web-based run control and configuration GUI are provided, and the online monitoring snapshots created after each beam spill are viewable from any computer connected to the Fermilab network. The integrated DAQ system for the facility provides users with high-precision tracking data along the beamline and a single location for obtaining data from the facility detectors, which set the baseline for testing their own detectors.

The muon campus program at Fermilab includes the Mu2e experiment that will search for a charged-lepton flavor violating processes where a negative muon converts into an electron in the field of an aluminum nucleus, improving by four orders of magnitude the search sensitivity reached so far. Mu2e's Trigger and Data Acquisition System (TDAQ) uses otsdaq as its solution. Developed at Fermilab, otsdaq uses the artdaq DAQ framework and art analysis framework, under the-hood, for event transfer, filtering, and processing. otsdaq is an online DAQ software suite with a focus on flexibility and scalability, while providing a multi-user, web-based, interface accessible through the Chrome or Firefox web browser. The detector Read Out Controller (ROC), from the tracker and calorimeter, stream out zero-suppressed data continuously to the Data Transfer Controller (DTC). Data is then read over the PCIe bus to a software filter algorithm that selects events which are finally combined with the data flux that comes froma Cosmic Ray Ve to System (CRV). A Detector Control System (DCS) for monitoring, controlling, alarming, and archiving has been developed using the Experimental Physics and Industrial Control System (EPICS) Open Source Platform. The DCS System has also been itegrated into otsdaq. The installation of the TDAQ and the DCS systems in the Mu2e building is planned for 2021-2022, and a prototype has been built at Fermilab's Feynman Computing Center. We report here on the developments and achievements of the integration of Mu2e's DCS system into the online otsdaq software.