Irene Zoi

The High Luminosity LHC (HL-LHC) is expected to deliver an integrated luminosity of $3000-4000\;$fb$^{-1}$ after 10 years of operation with peak instantaneous luminosity reaching about $5-7.5\times10^{34}$cm$^{-2}$s$^{-1}$. During Long Shutdown 3, several components of the CMS detector will undergo major changes, called Phase-2 upgrades, to be able to operate in the challenging environment of the HL-LHC. The current CMS silicon strip tracker has to be replaced with a new detector. The Phase-2 Outer Tracker (OT) will have high radiation tolerance, higher granularity and the capability to handle higher data rates. Another key feature of the OT will be to provide tracking information to the Level-1 trigger, allowing trigger rates to be kept at a sustainable level without sacrificing physics potential. For this, the OT will be made out of modules which have two closely spaced sensors read out by front-end ASICs, which can correlate hits in the two sensors creating short track segments, called stubs. The stubs will be used for tracking in the L1 track finder. In this contribution, the design of the CMS Phase-2 OT, the technological choices and first results with prototype devices are reported.

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1016 neq/cm2 at ∼3 cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n+ on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100μm or 130μm, that of 3D sensors 130μm. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of ∼5×1015 neq/cm2 are reported in this article.

The topic of the paper is the position reconstruction from signals of segmented detectors. With the help of a simple simulation, it is shown that the position reconstruction using the centre-of-gravity method is strongly biased, if the width of the charge (or e.g. light) distribution at the electrodes (or photo detectors) is less than the read-out pitch. A method is proposed which removes this bias for events with signals in two or more read-out channels and thereby improves the position resolution. The method also provides an estimate of the position–response function for every event. Examples are given for which its width as a function of the reconstructed position varies by as much as an order of magnitude. A fast Monte Carlo program is described which simulates the signals from a silicon pixel detector traversed by charged particles under different angles, and the results obtained with the proposed reconstruction method and with the centre-of-gravity method are compared. The simulation includes the local energy-loss fluctuations, the position-dependent electric field, the diffusion of the charge carriers, the electronics noise and charge thresholds for clustering, A comparison to test-beam-data is used to validate the simulation.

Planar n-in-n silicon detectors with small pitches and slim edges are being investigated for the innermost layers of tracking devices for the foreseen upgrades of the LHC experiments. Sensor prototypes compatible with the CMS readout, fabricated by Sintef, were tested in the laboratory and with a 120 GeV/c proton beam at the Fermilab test beam facility before and after irradiation with up to 2×1015 neq/cm2 fluence. Preliminary results of the data analysis are presented.

This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 $$\upmu $$ m and 130 $$\upmu $$ m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors.

This paper describes the development of new 3D and planar silicon pixel sensors designed for the Compact Muon Solenoid (CMS) Phase-2 Upgrade at High Luminosity LHC (HL-LHC).The project is funded by INFN and sensors are produced in collaboration with the FBK foundry.The HL-LHC will operate at an instantaneous luminosity approximately 5 times larger than the original LHC design, significantly increasing the number of concurrent collisions per bunch crossing, the integrated luminosity delivered to the experiments and, as a consequence, the radiation dose that the detectors will have to sustain.In order to cope with these future conditions, upgrades to the detectors are required.This is necessary for the pixel tracker that is the closest to the interaction point and will be replaced.In this paper, the results, from beam tests performed at Fermilab Test Beam Facility, of thin (100 µm and 130 µm thick) n-in-p type sensors, assembled into hybrid single chip modules bump bonded to the PSI46dig readout chip, will be presented.A comparison of the performances obtained with planar sensors before and after proton irradiation up to 3 × 10 15 n eq /cm 2 will be also discussed.The paper will also report the results obtained with the first 3D pixel sensors 130 µm thick with columnar electrodes for different pixel cell prototypes.The novelty of the 3D prototypes is their small pixel cell size, ranging form the standard 100 µm × 150 µm, down to 50 µm × 50 µm and 25 µm × 100 µm, which are the preferred dimensions in the high pile-up environment of the HL-LHC.

The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid- state pixel sensor capable of surviving fluencies up to a few 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">16</sup> particles cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> at ∼3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R & D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100µm and 130µm active thickness for planar sensors, and 130µm for 3D sensors, the thinnest ones ever produced so far. First prototypes of hybrid modules bump-bonded to the present CMS readout chips have been tested in beam tests. Preliminary results on their performance before and after irradiation are presented.

Pixelated silicon detectors are state-of-the-art technology to achieve precise tracking and vertexing at collider experiments, designed to accurately measure the hit position of incoming particles in high rate and radiation environments. The detector requirements become extremely demanding for operation at the High-Luminosity LHC, where up to 200 interactions will overlap in the same bunch crossing on top of the process of interest. Additionally, fluences up to 2.3 10^16 cm^-2 1 MeV neutron equivalent at 3.0 cm distance from the beam are expected for an integrated luminosity of 3000 fb^-1. In the last decades, the pixel pitch has constantly been reduced to cope with the experiment's needs of achieving higher position resolution and maintaining low pixel occupancy per channel. The spatial resolution improves with a decreased pixel size but it degrades with radiation damage. Therefore, prototype sensor modules for the upgrade of the experiments at the HL-LHC need to be tested after being irradiated. This paper describes position resolution measurements on planar prototype sensors with 100x25 um^2 pixels for the CMS Phase-2 Upgrade. It reviews the dependence of the position resolution on the relative inclination angle between the incoming particle trajectory and the sensor, the charge threshold applied by the readout chip, and the bias voltage. A precision setup with three parallel planes of sensors has been used to investigate the performance of sensors irradiated to fluences up to F_eq = 3.6 10^15 cm-2. The measurements were performed with a 5 GeV electron beam. A spatial resolution of 3.2 +\- 0.1 um is found for non-irradiated sensors, at the optimal angle for charge sharing. The resolution is 5.0 +/- 0.2 um for a proton-irradiated sensor at F_eq = 2.1 10^15 cm-2 and a neutron-irradiated sensor at F_eq = 3.6 10^15 cm^-2.

Pixelated silicon detectors are state-of-the-art technology to achieve precise tracking and vertexing at collider experiments, designed to accurately measure the hit position of incoming particles in high rate and radiation environments. The detector requirements become extremely demanding for operation at the High-Luminosity LHC, where up to 200 interactions will overlap in the same bunch crossing on top of the process of interest. Additionally, fluences up to 2.3 10^16 cm^-2 1 MeV neutron equivalent at 3.0 cm distance from the beam are expected for an integrated luminosity of 3000 fb^-1. In the last decades, the pixel pitch has constantly been reduced to cope with the experiment's needs of achieving higher position resolution and maintaining low pixel occupancy per channel. The spatial resolution improves with a decreased pixel size but it degrades with radiation damage. Therefore, prototype sensor modules for the upgrade of the experiments at the HL-LHC need to be tested after being irradiated. This paper describes position resolution measurements on planar prototype sensors with 100x25 um^2 pixels for the CMS Phase-2 Upgrade. It reviews the dependence of the position resolution on the relative inclination angle between the incoming particle trajectory and the sensor, the charge threshold applied by the readout chip, and the bias voltage. A precision setup with three parallel planes of sensors has been used to investigate the performance of sensors irradiated to fluences up to F_eq = 3.6 10^15 cm-2. The measurements were performed with a 5 GeV electron beam. A spatial resolution of 3.2 +\- 0.1 um is found for non-irradiated sensors, at the optimal angle for charge sharing. The resolution is 5.0 +/- 0.2 um for a proton-irradiated sensor at F_eq = 2.1 10^15 cm-2 and a neutron-irradiated sensor at F_eq = 3.6 10^15 cm^-2.