ϟ

André Rummler

Here are all the papers by André Rummler that you can download and read on OA.mg.
André Rummler’s last known institution is . Download André Rummler PDFs here.

Claim this Profile →
DOI: 10.17181/cern.fozz.zp3q
2018
Cited 49 times
Technical Design Report for the ATLAS inner Tracker pixel detector
DOI: 10.1088/1748-0221/14/10/p10033
2019
Cited 36 times
EUDAQ2—A flexible data acquisition software framework for common test beams
The data acquisition software framework, EUDAQ, was originally developed to read out data from the EUDET-type pixel telescopes. This was successfully used in many test beam campaigns in which an external position and time reference were required. The software has recently undergone a significant upgrade, EUDAQ2, which is a generic, modern and modular system for use by many different detector types, ranging from tracking detectors to calorimeters. EUDAQ2 is suited as an overarching software that links individual detector readout systems and simplifies the integration of multiple detectors. The framework itself supports several triggering and event building modes. This flexibility makes test beams with multiple detectors significantly easier and more efficient, as EUDAQ2 can adapt to the characteristics of each detector prototype during testing. The system has been thoroughly tested during multiple test beams involving different detector prototypes. EUDAQii has now been released and is freely available under an open-source license.
DOI: 10.1088/1748-0221/18/05/p05005
2023
Cited 5 times
Performance in beam tests of carbon-enriched irradiated Low Gain Avalanche Detectors for the ATLAS High Granularity Timing Detector
The High Granularity Timing Detector (HGTD) will be installed in the ATLAS experiment to mitigate pile-up effects during the High Luminosity (HL) phase of the Large Hadron Collider (LHC) at CERN. Low Gain Avalanche Detectors (LGADs) will provide high-precision measurements of the time of arrival of particles at the HGTD, improving the particle-vertex assignment. To cope with the high-radiation environment, LGADs have been optimized by adding carbon in the gain layer, thus reducing the acceptor removal rate after irradiation. Performances of several carbon-enriched LGAD sensors from different vendors, and irradiated with high fluences of 1.5 and 2.5 x 10^15 neq/cm2, have been measured in beam test campaigns during the years 2021 and 2022 at CERN SPS and DESY. This paper presents the results obtained with data recorded by an oscilloscope synchronized with a beam telescope which provides particle position information within a resolution of a few um. Collected charge, time resolution and hit efficiency measurements are presented. In addition, the efficiency uniformity is also studied as a function of the position of the incident particle inside the sensor pad.
DOI: 10.1088/1748-0221/18/08/p08019
2023
Cited 5 times
Performance of a front-end prototype ASIC for the ATLAS High Granularity timing detector
This paper presents the design and characterisation of a front-end prototype ASIC for the ATLAS High Granularity Timing Detector, which is planned for the High-Luminosity phase of the LHC. This prototype, called ALTIROC1, consists of a 5$\times$5-pad matrix and contains the analog part of the single-channel readout (preamplifier, discriminator, two TDCs and SRAM). Two preamplifier architectures (transimpedance and voltage) were implemented and tested. The ASIC was characterised both alone and as a module when connected to a 5$\times$5-pad array of LGAD sensors. In calibration measurements, the ASIC operating alone was found to satisfy the technical requirements for the project, with similar performances for both preamplifier types. In particular, the jitter was found to be 15$\pm$1~ps (35$\pm$1~ps) for an injected charge of 10~fC (4~fC). A degradation in performance was observed when the ASIC was connected to the LGAD array. This is attributed to digital couplings at the entrance of the preamplifiers. When the ASIC is connected to the LGAD array, the lowest detectable charge increased from 1.5~fC to 3.4~fC. As a consequence, the jitter increased for an injected charge of 4~fC. Despite this increase, ALTIROC1 still satisfies the maximum jitter specification (below 65~ps) for the HGTD project. This coupling issue also affects the time over threshold measurements and the time-walk correction can only be performed with transimpedance preamplifiers. Beam test measurements with a pion beam at CERN were also undertaken to evaluate the performance of the module. The best time resolution obtained using only ALTIROC TDC data was 46.3$\pm$0.7~ps for a restricted time of arrival range where the coupling issue is minimized. The residual time-walk contribution is equal to 23~ps and is the dominant electronic noise contribution to the time resolution at 15~fC.
DOI: 10.1088/1748-0221/13/06/p06017
2018
Cited 33 times
Beam test measurements of Low Gain Avalanche Detector single pads and arrays for the ATLAS High Granularity Timing Detector
For the high luminosity upgrade of the LHC at CERN, ATLAS is considering the addition of a High Granularity Timing Detector (HGTD) in front of the end cap and forward calorimeters at |z|= 3.5 m and covering the region 2.4 <|η|< 4 to help reducing the effect of pile-up. The chosen sensors are arrays of 50 μm thin Low Gain Avalanche Detectors (LGAD). This paper presents results on single LGAD sensors with a surface area of 1.3×1.3 mm2 and arrays with 2×2 pads with a surface area of 2×2 mm2 or 3×3 mm2 each and different implant doses of the p+ multiplication layer. They are obtained from data collected during a beam test campaign in autumn 2016 with a pion beam of 120 GeV energy at the CERN SPS. In addition to several quantities measured inclusively for each pad, the gain, efficiency and time resolution have been estimated as a function of the position of the incident particle inside the pad by using a beam telescope with a position resolution of few μm. Different methods to measure the time resolution are compared, yielding consistent results. The sensors with a surface area of 1.3×1.3 mm2 have a time resolution of about 40 ps for a gain of 20 and of about 27 ps for a gain of 50 and fulfil the HGTD requirements. Larger sensors have, as expected, a degraded time resolution. All sensors show very good efficiency and time resolution uniformity.
DOI: 10.1088/1748-0221/7/10/p10028
2012
Cited 25 times
Planar pixel sensors for the ATLAS upgrade: beam tests results
Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a function of fluence for different irradiations. Furthermore p-type silicon sensors from several vendors with slightly differing layouts were tested. All tested sensors were connected by bump-bonding to the ATLAS Pixel read-out chip. We show that both n-type and p-type tested planar sensors are able to collect significant charge even after integrated fluences expected at HL-LHC.
DOI: 10.1088/1748-0221/15/01/p01038
2020
Cited 16 times
EUDAQ—a data acquisition software framework for common beam telescopes
EUDAQ is a generic data acquisition software developed for use in conjunction with common beam telescopes at charged particle beam lines. Providing high-precision reference tracks for performance studies of new sensors, beam telescopes are essential for the research and development towards future detectors for high-energy physics. As beam time is a highly limited resource, EUDAQ has been designed with reliability and ease-of-use in mind. It enables flexible integration of different independent devices under test via their specific data acquisition systems into a top-level framework. EUDAQ controls all components globally, handles the data flow centrally and synchronises and records the data streams. Over the past decade, EUDAQ has been deployed as part of a wide range of successful test beam campaigns and detector development applications.
DOI: 10.22323/1.448.0072
2024
Qualification of irradiated 3D pixel sensors produced by FBK for the pre-production of the ATLAS ITk detector
DOI: 10.1051/epjconf/202429502014
2024
The ATLAS Alarm Helper
The Detector Safety System is the last line of defence to protect the ATLAS detector against abnormal and potentially even unforeseen situations. It is designed to return the detector to a safe state based on predefined actions triggered by alarms which are triggered on their part by specific sets of conditions. Every alarm whether it results in an action taken or not is followed up by the operations team that assesses the criticality, takes countermeasures and identifies the point of failure. From experience abnormal situations can result either from faults or from side effects of planned interventions which were either not properly identified despite the mandatory planning and review or where a mistake during execution occurred. In many cases there are multiple interventions ongoing simultaneously in order to profit from shutdown periods. The rapid analysis of alarms while the incident is ongoing is often complicated due to the complexity of the ATLAS detector and its infrastructure and the large number of responsible groups and experts. A new Alarm Helper tool was designed to assist the operation team, particularly the operator in the control room responsible for infrastructure and safety (SLIMOS – Shift Leader in Matters of Safety), by providing real-time information about ongoing interventions and the possible related causes of failure. The new tool will combine historical events, documentation, and limited knowledge about ongoing interventions. It extends the Expert System which visualizes and simulates infrastructure inter-dependencies and allows to trace faults or alarms to a list of potential points of failure. The new tool also proposes which experts should be contacted in the particular circumstances.
DOI: 10.1088/1748-0221/7/02/c02051
2012
Cited 17 times
Planar slim-edge pixel sensors for the ATLAS upgrades
The ATLAS detector at CERN is a general-purpose experiment at the Large Hadron Collider (LHC). The ATLAS Pixel Detector is the innermost tracking detector of ATLAS and requires a sufficient level of hermeticity to achieve superb track reconstruction performance. The current planar n-type pixel sensors feature a pixel matrix of n+-implantations which is (on the opposite p-side) surrounded by so-called guard rings to reduce the high voltage stepwise towards the cutting edge and an additional safety margin. Because of the inactive region around the active area, the sensor modules have been shingled on top of each other's edge which limits the thermal performance and adds complexity in the present detector. The first upgrade phase of the ATLAS pixel detector will consist of the insertable b-layer (IBL), an additional b-layer which will be inserted into the present detector in 2013. Several changes in the sensor design with respect to the existing detector had to be applied to comply with the IBL's specifications and are described in detail. A key issue for the ATLAS upgrades is a flat arrangement of the sensors. To maintain the required level of hermeticity in the detector, the inactive sensor edges have to be reduced to minimize the dead space between the adjacent detector modules. Unirradiated and irradiated sensors with the IBL design have been operated in test beams to study the efficiency performance in the sensor edge region and it was found that the inactive edge width could be reduced from 1100 μm to less than 250 μm.
DOI: 10.1016/j.nima.2010.11.186
2011
Cited 15 times
Planar n+-in-n silicon pixel sensors for the ATLAS IBL upgrade
The ATLAS experiment at the LHC is planning to upgrade its pixel detector by the installation of a 4th pixel layer, the insertable b-layer IBL with a mean sensor radius of only 32 mm from the beam axis. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5×1015 neq cm−2 at their end-of-life. To investigate the radiation hardness and suitability of the current ATLAS pixel sensors for IBL fluences, n+-in-n silicon pixel sensors from the ATLAS Pixel production have been irradiated by reactor neutrons to the IBL design fluence and been tested with pions at the SPS and with electrons from a 90Sr source in the laboratory. The collected charge was found to exceed 10 000 electrons per MIP at 1 kV of bias voltage which is in agreement with data collected with strip sensors. With an expected threshold of 3000–4000 electrons, this result suggests that planar n+-in-n pixel sensors are radiation hard enough to be used as IBL sensor technology.
DOI: 10.1016/j.nima.2020.164956
2021
Cited 9 times
Beam test results of NDL Low Gain Avalanche Detectors (LGAD)
A High-Granularity Timing Detector (HGTD) is proposed based on the Low-Gain Avalanche Detector (LGAD) for the ATLAS experiment to satisfy the time resolution requirement for the up-coming High Luminosity at LHC (HL-LHC). We report on beam test results for two proto-types LGADs (BV60 and BV170) developed for the HGTD. Such modules were manufactured by the Institute of High Energy Physics (IHEP) of Chinese Academy of Sciences (CAS) collaborated with Novel Device Laboratory (NDL) of the Beijing Normal University. The beam tests were performed with 5 GeV electron beam at DESY. The timing performance of the LGADs was compared to a trigger counter consisting of a quartz bar coupled to a SiPM readout while extracting reference SiPM by fitting with a Gaussian function. The time resolution was obtained as 41 ps and 63 ps for the BV60 and the BV170, respectively.
DOI: 10.1016/j.nima.2012.04.081
2013
Cited 11 times
Evaluation of novel KEK/HPK n-in-p pixel sensors for ATLAS upgrade with testbeam
Abstract A new type of n-in-p planar pixel sensors have been developed at KEK/HPK in order to cope with the maximum particle fluence of 1–3×1016 1 MeV equivalent neutrons per square centimeter ( n eq / cm 2 ) in the upcoming LHC upgrades. Four n-in-p devices were connected by bump-bonding to the new ATLAS Pixel front-end chip (FE-I4A) and characterized before and after the irradiation to 2×1015 n eq / cm 2 . These planar sensors are 150 μ m thick, using biasing structures made out of polysilicon or punch-through dot and isolation structures of common or individual p-stop. Results of measurements with radioactive 90Sr source and with a 120 GeV/c momentum pion beam at the CERN Super Proton Synchrotron (SPS) are presented. The common p-stop isolation structure shows a better performance than the individual p-stop design, after the irradiation. The flat distribution of the collected charge in the depth direction after the irradiation implies that the effect of charge trapping is small, at the fluence, with the bias voltage well above the full depletion voltage.
DOI: 10.1016/j.nantod.2021.101270
2021
Cited 7 times
Scalable manufacturing of fibrous nanocomposites for multifunctional liquid sensing
Cellulose-based paper electronics is an attractive technology to meet the growing demands for naturally abundant, biocompatible, biodegradable, flexible, inexpensive, lightweight and highly miniaturizable sensory materials. The price reduction of industrial carbon nanotube (CNT) grades offers opportunities to manufacture electrically conductive papers whose resistivity is responsive to environmental stimuli, such as the presence of water or organic solvents. Here, a highly sensitive paper nanocomposite is developed by integrating CNTs into a hierarchical network of pulp fibers and nanofibrillated cellulose. The aqueous-phase dynamic web forming process enables the scalable production of sensory paper nanocomposites with minimal nanoparticle loss due to the tailored interfacial bonding between CNT and cellulose components. The resulting materials are applied as multifunctional liquid sensors, such as leak detection and wave monitoring. The sensitivity to liquid water spans an outstanding four orders of magnitude even after 30 cycles and 6-month natural aging, due to the hydroexpansion of the hierarchical cellulose network, which alters the intertube distance between neighboring CNTs. The re-organization of percolated CNTs modifies the electron transport in wet areas of the sheet, which can be predicted by an equivalent circuit of resistors for the rapid detection and quantification of various liquids over large surfaces.
DOI: 10.1088/1748-0221/17/09/p09026
2022
Cited 4 times
Performance in beam tests of irradiated Low Gain Avalanche Detectors for the ATLAS High Granularity Timing Detector
Abstract The High Granularity Timing Detector (HGTD) will be installed in the ATLAS detector to mitigate pile-up effects during the High Luminosity (HL) upgrade of the Large Hadron Collider (LHC) at CERN. The design of the HGTD is based on the use of Low Gain Avalanche Detectors (LGADs), with an active thickness of 50 μm, that allow to measure with high-precision the time of arrival of particles. The HGTD will improve the particle-vertex assignment by measuring the track time with a resolution ranging from approximately 30 ps at the beginning of the HL-LHC operations to 50 ps at the end. Performances of several unirradiated, as well as neutron- and proton-irradiated, LGAD sensors from different vendors have been measured in beam test campaigns during the years 2018 and 2019 at CERN SPS and DESY. This paper presents the results obtained with data recorded by an oscilloscope synchronized with a beam telescope which provides particle position information within a resolution of a few μm. Collected charge, time resolution and hit efficiency are presented. In addition to these properties, the charge uniformity is also studied as a function of the position of the incident particle inside the sensor pad.
DOI: 10.1088/1748-0221/18/01/c01010
2023
Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip
Abstract ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × 100 μm 2 (barrel) or 50 × 50 μm 2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm 2 ) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.
DOI: 10.1016/j.nima.2011.05.074
2011
Cited 9 times
Radiation hardness studies of n+-in-n planar pixel sensors for the ATLAS upgrades
The ATLAS experiment at the LHC is planning upgrades of its pixel detector to cope with the luminosity increase foreseen in the coming years within the transition from LHC to Super-LHC (SLHC/HL-LHC). Associated with the increase in instantaneous luminosity is a rise of the target integrated luminosity from 730 to about 3000 fb−1 which directly translates into significantly higher radiation damage. These upgrades consist of the installation of a 4th pixel layer, the insertable b-layer IBL, with a mean sensor radius of only 32 mm from the beam axis, before 2016/17. In addition, the complete pixel detector will be exchanged before 2020/21. Being very close to the beam, the radiation damage of the IBL sensors might be as high as 5×1015neqcm−2 at their end-of-life. The total fluence of the innermost pixel layer after the SLHC upgrade might even reach 2×1016neqcm−2. To investigate the radiation hardness and suitability of the current ATLAS pixel sensors for these fluences, n+-in-n silicon pixel sensors from the ATLAS Pixel production have been irradiated by reactor neutrons to the IBL design fluence and been tested with pions at the SPS and with electrons from a 90Sr source in the laboratory. The collected charge after IBL fluences was found to exceed 10 000 electrons per MIP at 1 kV of bias voltage which is in agreement with data collected with strip sensors. After SLHC fluences, still reliable operation of the devices could be observed with a collected charge of more than 5000 electrons per MIP.
DOI: 10.1016/j.nima.2014.05.092
2014
Cited 6 times
Evaluation of KEK n-in-p planar pixel sensor structures for very high radiation environments with testbeam
Various structures for n-in-p planar pixel sensors have been developed at KEK in order to cope with the huge particle fluence in the upcoming LHC upgrades. Performances of the sensors with different structures have been evaluated with testbeam. The n-in-p devices were connected by bump-bonding to the ATLAS Pixel front-end chip (FE-I4A) and characterized before and after the irradiation to 1×1016 1 MeV neq/cm2. Results of measurements with 120 GeV/c momentum pion beam at the CERN Super Proton Synchrotron (SPS) in September 2012 are presented.
DOI: 10.1088/1748-0221/12/05/p05006
2017
Cited 4 times
Performance of active edge pixel sensors
To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical acceptance. The active edge technology allows to reduce the insensitive area at the border of the sensor thanks to an ion etched trench which avoids the crystal damage produced by the standard mechanical dicing process. Thin planar n-on-p pixel sensors with active edge have been designed and produced by LPNHE and FBK foundry. Two detector module prototypes, consisting of pixel sensors connected to FE-I4B readout chips, have been tested with beams at CERN and DESY. In this paper the performance of these modules are reported. In particular the lateral extension of the detection volume, beyond the pixel region, is investigated and the results show high hit-efficiency also at the detector edge, even in presence of guard rings.
DOI: 10.1016/j.nima.2018.09.041
2019
Cited 3 times
Test beam evaluation of silicon strip modules for ATLAS phase-II strip tracker upgrade
The planned High Luminosity Large Hadron Collider is being designed to maximise the physics potential of the LHC with 10 years of operation at instantaneous luminosities of 7.5×1034cm−2s−1. A consequence of this increased luminosity is the expected radiation damage requiring the tracking detectors to withstand hadron fluence to over 1×1015 1 MeV neutron equivalent per cm2 in the ATLAS Strips system. Fast readout electronics, deploying 130 nm CMOS front-end electronics are glued on top of a silicon sensor to make a module. The radiation hard n-in-p micro-strip sensors used have been developed by the ATLAS ITk Strip Sensor collaboration and produced by Hamamatsu Photonics. A series of tests were performed at the DESY-II test beam facility to investigate the detailed performance of a strip module with both 2.5 cm and 5 cm length strips before irradiation. The DURANTA telescope was used to obtain a pointing resolution of 2 μm, with an additional pixel layer installed to improve timing resolution to ∼25 ns. Results show that prior to irradiation a wide range of thresholds (0.5–2.0 fC) meet the requirements of a noise occupancy less than 1×10−3 and a hit efficiency greater than 99%.
DOI: 10.1088/1748-0221/13/08/p08020
2018
Cited 3 times
Beam tests of silicon pixel 3D-sensors developed at SINTEF
For the purpose of withstanding very high radiation doses, silicon pixel sensors with a 3D electrode geometry are being developed. Detectors of this kind are highly interesting for harch radiation environments such as expected in the High Luminosity LHC, but also for space physics and medical applications. In this paper, prototype sensors developed at SINTEF are presented and results from tests in a pion beam at CERN are given. These tests shows that these 3D sensors perform as expected with full efficiency at bias voltages between 5 and 15V.
DOI: 10.1016/j.nima.2014.04.059
2014
Temperature-dependent characterizations of irradiated planar n + -in-n pixel assemblies
Measurements of the leakage current scaling and tuning of front-end electronics due to temperature changes in a range between −30 °C and 0 °C are presented. Assemblies have been irradiated to fluences of 6.8×1015neqcm−2. A leakage current temperature scaling parameter Eg,eff=(1.108±0.047)eV is found, which is compatible within errors to earlier measurements of non-irradiated or lower irradiated silicon. Secondly, sensitivity of tuning parameters of the employed front-end electronics in terms of threshold and ToT values can be seen. A study of current and charge collection efficiency in an assembly irradiated to a fluence of 2×1016neqcm−2 has been carried out, showing a current related damage factor αI compatible to studies at lower irradiation levels. Charge collection stays constant with consecutively applied annealing steps and front-end electronics shows only slight changes in tuning parameters.
DOI: 10.1088/1742-6596/2438/1/012045
2023
Graph-based algorithm for the understanding of failures in the ATLAS infrastructure
Abstract The ATLAS Technical Coordination Expert System is a knowledge-based application which describes and simulates the ATLAS experiment based on its components and their relationships with differing levels of granularity but with an emphasis on general infrastructure. It facilitates the sharing of knowledge and improves the communication among experts with different backgrounds and domains of expertise. The developed software has become essential for the planning of interventions as it gives easily insight into their consequences. Furthermore, it has also proven to be useful for exploring the most effective ways to improve the ATLAS operation and reliability by identifying points of failure with significant impact. The underlying database describes more than 13,000 elements with 89,000 relationships among them. It combines information from diverse domains such as detector control and safety systems, gas and water supplies, cooling, ventilation, cryogenics, and electricity distribution. As the most recent addition, a tool to identify the most probable cause of a failure state has been developed. This paper discusses the graph-based algorithm currently implemented by that tool and shows its behaviour based on the parameters entered by the user. An example in form of a real failure event is given which demonstrates the potential of the Expert System for understanding major failures faster in urgent situations.
DOI: 10.22323/1.420.0025
2023
Qualification of the first pre-production 3D FBK sensors with ITkPixV1 readout chip
The ITk detector, the new ATLAS silicon tracking system for the High Luminosity LHC (HL-LHC), will be equipped with 3D pixel sensor modules in the innermost layer (L0).The pixel cell dimensions will be 25×100 µm 2 in the barrel and 50×50 µm 2 in the end-caps, with one readout electrode at the centre of each pixel and four bias electrodes at the corners.Sensors from pre-production wafers (50×50 µm 2 ) produced by FBK have been bump-bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards (SCCs) and characterized in laboratory measurements and in test beam campaigns.Some of these modules have been irradiated in Bonn and at the CERN IRRAD facility.Preliminary results of their characterization after irradiation are shown, including measurements performed during test beam campaigns at CERN SPS in Summer 2022.
DOI: 10.13109/9783666565618.675
2023
Fliegel Flügel verleihen
Open AccessFliegel Flügel verleihenJuan Garcés, Anna S. Meyer, Arne Rümmler, Kay-Michael WürznerJuan GarcésSearch for more papers by this author, Anna S. MeyerSearch for more papers by this author, Arne RümmlerSearch for more papers by this author, Kay-Michael WürznerSearch for more papers by this authorhttps://doi.org/10.13109/9783666565618.675SectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack Citations ShareShare onFacebookTwitterLinkedInRedditEmail About Previous chapter Next chapter FiguresReferencesRelatedDetails Download book coverArbeiten zur Geschichte des PietismusVolume 69 1. AuflageISBN: 978-3-525-56561-2 eISBN: 978-3-666-56561-8HistoryPublished online:December 2023 Information© 2023 Vandenhoeck & Ruprecht, Robert-Bosch-Breite 10, D-37079 Göttingen, ein Imprint der Brill-GruppeDas Werk ist als Open-Access-Publikation im Sinne der Creative-Commons-Lizenz BY-NC-ND International 4.0 (»Namensnennung – Nicht kommerziell – Keine Bearbeitung«) unter dem DOI https://doi.org/10.13109/9783666565618 abzurufen. Um eine Kopie dieser Lizenz zu sehen, besuchen Sie https://creativecommons.org/licenses/by-nc-nd/4.0/.PDF download
DOI: 10.1051/epjconf/201921405035
2019
ATLAS Technical Coordination Expert System
When planning an intervention on a complex experiment like ATLAS, the detailed knowledge of the system under intervention and of the interconnection with all the other systems is mandatory. In order to improve the understanding of the parties involved in an intervention, a rule-based expert system has been developed. On the one hand this helps to recognise dependencies that are not always evident and on the other hand it facilitates communication between experts with different backgrounds by translating between vocabularies of specific domains. To simulate an event this tool combines information from different areas such as detector control (DCS) and safety (DSS) systems, gas, cooling, ventilation, and electricity distribution. The inference engine provides a list of the systems impacted by an intervention even if they are connected at a very low level and belong to different domains. It also predicts the probability of failure for each of the components affected by an intervention. Risk assessment models considered are fault tree analysis and principal component analysis. The user interface is a web-based application that uses graphics and text to provide different views of the detector system adapted to the different user needs and to interpret the data
DOI: 10.1016/j.nima.2016.04.004
2016
Test beam evaluation of newly developed n-in-p planar pixel sensors for use in a high radiation environment
Radiation-tolerant n-in-p planar pixel sensors have been under development in cooperation with Hamamatsu Photonics K.K. (HPK). This is geared towards applications in high-radiation environments, such as for the future Inner Tracker (ITk) placed in the innermost part of the ATLAS detector in the high luminosity LHC (HL-LHC) experiment. Prototypes of those sensors have been produced, irradiated, and evaluated over the last few years. In the previous studies, it was reported that significant drops in the detection efficiency were observed after irradiation, especially under bias structures. The bias structures are made up of poly-Si or Al bias rails and poly-Si bias resistors. The structure is implemented on the sensors to allow quality checks to be performed before the bump-bonding process, and to ensure that charge generated in floating pixels due to non-contacting or missing bump-bonds is dumped in a controlled way in order to avoid noise. To minimize the efficiency drop, several new pixel structures have been designed with bias rails and bias resistors relocated. Several test beams have been carried out to evaluate the drops in the detection efficiency of the new sensor structures after irradiation. Newly developed sensor modules were irradiated with proton-beams at the Cyclotron and Radio-Isotope Center (CYRIC) in Tohoku University to see the effect of sensor-bulk damage and surface charge-up. An irradiation with γ-rays was also carried out at Takasaki Advanced Radiation Research Center, with the goal of decoupling the effect of surface charge-up from that of bulk damage. Those irradiated sensors have been evaluated with particle beams at DESY and CERN. Comparison between different sensor structures confirmed significant improvements in minimizing efficiency loss under the bias structures after irradiation. The results from γ-irradiation also enabled cross-checking the results of a semiconductor technology simulation program (TCAD).
DOI: 10.1088/1748-0221/17/08/p08003
2022
Radiation hard 3D silicon pixel sensors for use in the ATLAS detector at the HL-LHC
Abstract The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detector to tolerate extremely high radiation doses. Specifically, the innermost parts of the pixel system will have to withstand radiation fluences above 1 × 10 16 n eq cm -2 . Novel 3D silicon pixel sensors offer a superior radiation tolerance compared to conventional planar pixel sensors, and are thus excellent candidates for the innermost parts of the ITk. This paper presents studies of 3D pixel sensors with pixel size 50 × 50 μm 2 mounted on the RD53A prototype readout chip. Following a description of the design and fabrication steps, Test Beam results are presented for unirradiated as well as heavily irradiated sensors. For particles passing at perpendicular incidence, it is shown that average efficiencies above 96% are reached for sensors exposed to fluences of 1 × 10 16 n eq cm -2 when biased to 80 V.
DOI: 10.1051/epjconf/202125104003
2021
Understanding ATLAS infrastructure behaviour with an Expert System
The ATLAS detector requires a huge infrastructure consisting of numerous interconnected systems forming a complex mesh which undergoes constant maintenance and upgrades. The ATLAS Technical Coordination Expert System provides, by the means of a user interface, a quick and deep understanding of the infrastructure, which helps to plan interventions by foreseeing unexpected consequences, and to understand complex events when time is crucial in the ATLAS control room. It is an object-oriented expert system based on the knowledge composed of inference rules and information from diverse domains such as detector control and safety systems, gas, water, cooling, ventilation, cryogenics, and electricity distribution. This paper discusses the latest developments in the inference engine and the implementation of the most probable cause algorithm based on them. One example from the annual maintenance of the 15°C water circuit chillers is discussed.
DOI: 10.17877/de290r-14138
2014
Investigation of radiation damage in n+-in-n planar pixel sensors for future ATLAS pixel detector upgrades
DOI: 10.48550/arxiv.2202.10271
2022
Radiation Hard 3D Silicon Pixel Sensors for use in the ATLAS Detector at the HL-LHC
The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detector to tolerate extremely high radiation doses. Specifically, the innermost parts of the pixel system will have to withstand radiation fluences above $1\times10^{16}$ $n_{eq}cm^{-2}$. Novel 3D silicon pixel sensors offer a superior radiation tolerance compared to conventional planar pixel sensors, and are thus excellent candidates for the innermost parts of the ITk. This paper presents studies of 3D pixel sensors with pixel size $50 \times 50$ $\mu m^2$ mounted on the RD53A prototype readout chip. Following a description of the design and fabrication steps, Test Beam results are presented for unirradiated as well as heavily irradiated sensors. For particles passing at perpendicular incidence, it is shown that average efficiencies above 96% are reached for sensors exposed to fluences of $1\times10^{16}$ $n_{eq}cm^{-2}$ when biased to 80 $V$.
2018
Summary and Conclusions of the 'JRA Beam Telescope 2025'-Forum at the 6th Beam Telescopes and Test Beams Workshop : arXiv
On January 17th 2018, a forum on a possible Joint Research Activity on a future common Beam Telescope was held during the 6th Beam Telescopes and Test Beams Workshop (BTTB) in Zurich, Switzerland. The BTTB workshop aims at bringing together the community involved in beam tests. It therefore offers a suitable platform to induce community-wide discussions. The forum and its discussions were well received and the participants concluded that appropriate actions should be undertaken promptly. Specific hardware and software proposals were discussed, with an emphasis on improving current common EUDET-type telescopes based on Mimosa26 sensors towards higher trigger rate capabilities in convolution with considerably improved time resolution. EUDAQ as a common top level DAQ and its modular structure is ready for future hardware. EUTelescope fulfils many requirements of a common reconstruction framework, but has also various drawbacks. Thus, requirements for a new common reconstruction framework were collected. A new common beam telescope evolves with the sensor decision and the whole package including a reconstruction framework depends on that decision.
DOI: 10.18429/jacow-icalepcs2019-mocpr03
2019
JACoW : Planning of Interventions With the Atlas Expert System
DOI: 10.48550/arxiv.1805.09572
2018
Summary and Conclusions of the 'JRA Beam Telescope 2025'-Forum at the 6th Beam Telescopes and Test Beams Workshop
On January 17th 2018, a forum on a possible Joint Research Activity on a future common Beam Telescope was held during the 6th Beam Telescopes and Test Beams Workshop (BTTB) in Zurich, Switzerland. The BTTB workshop aims at bringing together the community involved in beam tests. It therefore offers a suitable platform to induce community-wide discussions. The forum and its discussions were well received and the participants concluded that appropriate actions should be undertaken promptly. Specific hardware and software proposals were discussed, with an emphasis on improving current common EUDET-type telescopes based on Mimosa26 sensors towards higher trigger rate capabilities in convolution with considerably improved time resolution. EUDAQ as a common top level DAQ and its modular structure is ready for future hardware. EUTelescope fulfils many requirements of a common reconstruction framework, but has also various drawbacks. Thus, requirements for a new common reconstruction framework were collected. A new common beam telescope evolves with the sensor decision and the whole package including a reconstruction framework depends on that decision.